Semiconductor module

ABSTRACT

A semiconductor module includes a chip formed on an integrated circuit, a first external connecting terminal electrically connected to the integrated circuit, a printed wiring board having a second external connecting terminal, and a conductive material electrically connected the first external connecting terminal with the second external connecting terminal, wherein the conductive material formed so as to cover a sidewall of the second external connecting terminal. Accordingly, the semiconductor module can provide a semiconductor module that can prevent an inferior of an connection causing by a crack between the lead and the pad.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention generally relates to a semiconductor module, and more particularly, the present invention relates to a pattern shape for a contacting portion formed on a printed wiring board.

[0003] This application is a counterpart of Japanese application Serial Number 096414/1999, filed Apr. 2, 1999, the subject matter of which is incorporated herein by reference.

[0004] 2. Description of the Related Art

[0005]FIG. 3 is a schematic diagram showing a semiconductor module of a conventional art.

[0006] As shown in FIG. 3, a plurality of surface mounting type semiconductor packages 101 (e.g. T-SOP (Thin-Small Outline Package) is mounted on a memory module. Concretely, for forming an electric circuit, the plurality of surface mounting type semiconductor packages 101 are formed on a printed wiring board 102 (e.g. a glass epoxy resin substrate, or a ceramic substrate). The printed wiring board 102 has a structure formed a conductive pattern on an insulating material. For electrically connecting a module product with an external device (e.g. a personal computer), a plurality of external terminals 103 is formed on the printed wiring board 102.

[0007]FIG. 4 is a cross-sectional view taken in the direction of the arrows substantially along the line a-a of FIG. 3.

[0008] As shown in FIG. 4, the plurality of surface mounting type semiconductor packages 101 is made up of a semiconductor device 201 having an integrated circuit, a lead 202 for transferring an electrical signal of the semiconductor device 201 to an external portion, a wiring 203 (e.g. the wiring made of a gold or an aluminum) for transferring an electrical signal of the semiconductor device 201 to the lead 202, a resin 204 (e.g. an epoxy resin, a silicon resin) for preventing the semiconductor device 201 and the wiring 203 from an external force, a printed wiring board 205 (e.g. a glass epoxy substrate, a ceramic substrate) formed a conductive pattern, a pad 206 for transferring an electrical signal of the semiconductor device 201 formed on the printed wiring board 205 to the external portion, a conductive material (e.g. a solder, and a conductive resin, an Ag paste)electrically connected the lead 202 with the pad 206. The plurality of surface mounting type semiconductor packages 101 constructed as mentioned above is mounted on an upper surface and a behind surface of the printed wiring board 205.

[0009]FIG. 5 is an enlarged plane view of b portion in FIG. 3. As shown in FIG. 5, a pad 302 formed on a printed wiring board 301 has a width wider than a lead 304.

[0010]FIG. 6 is a cross-sectional view taken in the direction of the arrows substantially along the line c-c of FIG. 3.

[0011] As shown in FIG. 6, a lead 403 for the plurality of surface mounting type semiconductor packages 101 is electrically connected to a pad 402 formed on a printed wiring board 401 via a conductive material. The pad 402 is set to a width wider than a lead 403.

[0012] In the conventional art, it is desired to prevent an inferior of an connection causing by a crack between the lead and the pad.

SUMMARY OF THE INVENTION

[0013] An object of the present invention is to provide a semiconductor module that can prevent an inferior of an connection causing by a crack between the lead and the pad.

[0014] According to one aspect of the present invention, for achieving the above object, there is provided a semiconductor module comprising a chip formed on an integrated circuit, a first external connecting terminal electrically connected to the integrated circuit, a printed wiring board having a second external connecting terminal; and a conductive material electrically connected the first external connecting terminal with the second external connecting terminal, wherein the conductive material formed so as to cover a sidewall of the second external connecting terminal.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] While the specification concludes with claims particularly pointing out and distinctly claiming the subject matter that is regarded as the invention, the invention, along with the objects, features, and advantages thereof, will be better understood from the following description taken in connection with the accompanying drawings, in which:

[0016]FIG. 1 is a cross-sectional view showing a semiconductor module according to a first preferred embodiment of a present invention.

[0017]FIG. 3 is a schematic diagram showing a semiconductor module of a conventional art.

[0018]FIG. 4 is a cross-sectional view taken in the direction of the arrows substantially along the line a-a of FIG. 3.

[0019]FIG. 5 is an enlarged plane view of b portion in FIG. 3.

[0020]FIG. 6 is a cross-sectional view taken in the direction of the arrows substantially along the line c-c of FIG. 3.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] An internal generating circuit according to a first preferred embodiment of the present invention will hereinafter be described in detail with reference to the accompanying drawings.

[0022]FIG. 1 is a cross-sectional view showing a semiconductor module according to a first preferred embodiment of a present invention.

[0023] As shown in FIG. 1, a semiconductor module is preferably made up of a printed wiring board 601 (e.g. a glass epoxy resin substrate, a ceramic substrate) formed a plurality of conductive patterns on a surface, a semiconductor package having a chip formed an integrated circuit(not shown) on a surface and a plurality of leads 602 as a first external connecting terminal electrically connected to the integrated circuit, a plurality of pads 603 as a second external connecting terminal formed on the printed wiring board 601, and a plurality of conductive materials 604 (e.g. a solder, a conductive resin, an Ag paste) electrically connected between each of leads 602 and each of pads 603.

[0024] The first preferred embodiment of the present invention is characterized by each of pads 603 has a width equal to or narrower than each of leads 602. As a result, the respective conductive materials 604 is formed so as to cover a sidewall of the respective pads 603.

[0025] Accordingly, the first preferred embodiment of the present invention can increase a contact area of the conductive material against the pad.

[0026] As mentioned above, the first preferred embodiment of the present invention can prevent an inferior of an connection causing by a crack between the lead and the pad because of the increasing of the contact area.

[0027]FIG. 2 is a cross-sectional view showing a semiconductor module according to a second preferred embodiment of a present invention.

[0028] As shown in FIG. 2, a semiconductor module is preferably made up of a printed wiring board 901 (e.g. a glass epoxy resin substrate, a ceramic substrate) formed a plurality of conductive patterns on a surface, a semiconductor package having a chip formed an integrated circuit(not shown) on a surface and a plurality of leads 902 as a first external connecting terminal electrically connected to the integrated circuit, a plurality of pads 903 as a second external connecting terminal formed on the printed wiring board 601, and a plurality of conductive materials 904 (e.g. a solder, a conductive resin, an Ag paste) electrically connected between each of leads 602 and each of pads 903.

[0029] The second preferred embodiment of the present invention is characterized by each of pads 903 has a width equal to or narrower than each of leads 902 and has a convex surface on a surface. As a result, the respective conductive materials 904 is formed so as to cover a sidewall of the respective pads 903 and the convex surface of the respective pads 903. Here, the convex surface of the respective pads 903 is formed using an etching process or an ion-milling process.

[0030] Accordingly, the second preferred embodiment of the present invention can increase a contact area of the conductive material against the pad, compared with the first preferred embodiment of the present invention.

[0031] As mentioned above, the second preferred embodiment of the present invention can prevent an inferior of an connection causing by a crack between the lead and the pad because of the increasing of the contact area, compared with the first preferred embodiment of the present invention.

[0032] While the present invention has been described with reference to the illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to those skilled in the art on reference to this description. It is therefore contemplated that the appended claims will cover any such modifications or embodiments as fall within the true scope of the invention. 

What is claimed is:
 1. A semiconductor module comprising: a chip formed on an integrated circuit; a first external connecting terminal electrically connected to the integrated circuit; a printed wiring board having a second external connecting terminal; and a conductive material electrically connected the first external connecting terminal with the second external connecting terminal; wherein the conductive material formed so as to cover a sidewall of the second external connecting terminal.
 2. A semiconductor module as claimed in claim 1, wherein the first external connecting terminal is a lead.
 3. A semiconductor module as claimed in claim 1, wherein the second external connecting terminal is a pad.
 4. A semiconductor module as claimed in claim 1, wherein the conductive material is a solder.
 5. A semiconductor module as claimed in claim 1, wherein the chip is an electronic component, a semiconductor element, or a semi-insulating element.
 6. A semiconductor module as claimed in claim 1, wherein the second external connecting terminal has a convex surface.
 7. A semiconductor module comprising: a chip formed on an integrated circuit; a first external connecting terminal electrically connected to the integrated circuit; a printed wiring board having a second external connecting terminal; and a conductive material electrically connected the first external connecting terminal with the second external connecting terminal; wherein the second external connecting terminal having a width equal to or narrower than the first external connecting terminal.
 8. A semiconductor module as claimed in claim 7, wherein the first external connecting terminal is a lead.
 9. A semiconductor module as claimed in claim 7, wherein the second external connecting terminal is a pad.
 10. A semiconductor module as claimed in claim 7, wherein the conductive material is a solder.
 11. A semiconductor module as claimed in claim 7, wherein the chip is an electronic component, a semiconductor element, or a semi-insulating element.
 12. A semiconductor module as claimed in claim 7, wherein the second external connecting terminal has a convex surface. 